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Ori Floor

OriFloor is one of the Styrofoam Plan ranges of insulation products manufactured by Oriental Polystyrene (OriFoam) to suit specific applications.

Ori-Floor insulation boards have been developed specifically for use in floor applications since they possess the following unique physical properties:

High compressive strength.
High water absorption resistance.
Low thermal conductivity
Good handling characteristics
  • Thermal conductivity of 0.026 W/m K respectively when tested at 10oC  (50oF) in accordance with ASTM C 518.
  • Compressive strength of 550 kPa (100 psi)  average, when tested according to ASTM D 1621.
  • Design load for traffic 120 kPa (20 psi) and 160kPa (23 psi) averages respectively.
  • Water absorption of <3% in volume average when tested in accordance with ASTM D 272.
  • Edge Treatment Ship lap or Butt Edge.

What is Extruded Polystrene ?

Extruded thermal insulation boards were developed in 1947. Since then, advance processes, products and application research and development work has taken place in the U.S.A., Canada, Japan and Europe. Today, a variety of grades of extruded polystyrene, tailored to many applications and industries, is available in various sizes and with various edge treatments.

Extruded polystyrene foam is used in many parts of the world under widely differing climactic conditions. For example, it's in the Middle East at ambient temperatures of more than  40 0C (+1040F), while, at the other extreme has been used in Alaska to protect the delicate permafrost at temperatures as low as -500C (- 58 0F) along200 km of gravel road servicing the Trans Alaska Oil Pipeline.

Extruded polystyrene rigid foam has a high resistance to water absorption and good mechanical properties. The manufacturing process, combined with the inherent qualities of the inert component thermo plastic material gives extruded polystyrene predictable long-term performance and high insulating value

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